Coating apparatus and coating method

ABSTRACT

An apparatus includes substrate holders each configured to hold a substrate, a first nozzle provided for each substrate holder and for discharging a first processing liquid to the substrate at a first position, a second nozzle provided to be shared by the substrate holders and for discharging a second processing liquid to the substrate at a second position, a third nozzle provided for each substrate holder and for discharging a third processing liquid to the substrate at a third position while the first and second processing liquids are not supplied to the substrate, first to third standby parts for respectively allowing the first to third nozzles to wait outside a substrate holding region, a turning mechanism for turning the first nozzle between the first standby part and the first position, and a linear motion mechanism for linearly moving the third nozzle between the third standby part and the third position.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2019-108972, filed on Jun. 11, 2019, theentire contents of which are incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a coating apparatus and a coatingmethod.

BACKGROUND

In a process of manufacturing a semiconductor device, a coatingapparatus is used, and a processing liquid for forming a coating filmsuch as a resist is supplied to a semiconductor wafer (hereinafter,referred to as a “wafer”), which is a substrate, to form the coatingfilm. Patent Document 1 discloses a liquid processing apparatus, whichis a coating apparatus including two processing parts configured toprocess a wafer, a nozzle group consisting of a large number of nozzles,a temperature adjustment unit configured to hold the nozzle group onstandby, and a nozzle moving mechanism. The above-described nozzlemoving mechanism moves one nozzle selected from the nozzle group betweenthe processing parts and the temperature adjustment unit. Theabove-described nozzle moving mechanism, the nozzle group, and thetemperature adjustment unit are commonly used by the two processingparts.

PRIOR ART DOCUMENT Patent Document

Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-034210

SUMMARY

According to one embodiment of the present disclosure, there is provideda coating apparatus including: a plurality of substrate holders eachconfigured to hold a substrate; a first nozzle provided for each of theplurality of substrate holders and configured to discharge a firstprocessing liquid to the substrate at a first discharge position on thesubstrate held by each of the plurality of substrate holders; a secondnozzle provided to be shared by the plurality of substrate holders andconfigured to move independently of the first nozzle and configured todischarge a second processing liquid for forming a coating film to thesubstrate at a second discharge position on the substrate held by eachof the plurality of substrate holders, after the discharge of the firstprocessing liquid; a third nozzle provided for each of the plurality ofsubstrate holders and configured to move independently of the firstnozzle and the second nozzle and configured to discharge a thirdprocessing liquid to the substrate at a third discharge position on thesubstrate held by each of the plurality of substrate holders while thefirst processing liquid and the second processing liquid are notsupplied to the substrate; a first standby part, a second standby part,and a third standby part, configured to respectively allow the firstnozzle, the second nozzle, and the third nozzle to wait outside a regionin which the substrate is held by each of the plurality of substrateholders in a plan view; a turning mechanism configured to turn the firstnozzle in a plan view between the first standby part and the firstdischarge position; and a linear motion mechanism configured to linearlymove the third nozzle in a plan view between the third standby part andthe third discharge position.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the presentdisclosure, and together with the general description given above andthe detailed description of the embodiments given below, serve toexplain the principles of the present disclosure.

FIG. 1 is a schematic diagram of a substrate processing apparatusincluding a resist coating module according to an embodiment of thepresent disclosure.

FIG. 2 is a plan view of the resist coating module.

FIG. 3 is a perspective view of the resist coating module.

FIG. 4 is a vertical cross-sectional side view of a cup provided in theresist coating module.

FIG. 5A is a perspective view of a shared arm constituting the resistcoating module.

FIG. 5B is a top view illustrating a positional relationship betweencomponents provided on the shared arm.

FIG. 6 is a side view of a resist nozzle held by the shared arm.

FIG. 7 is an explanatory view illustrating an operation of nozzlesprovided in the resist coating module.

FIG. 8 is an explanatory view illustrating an operation of nozzlesprovided in the resist coating module.

FIG. 9 is an explanatory view illustrating an operation of nozzlesprovided in the resist coating module.

FIG. 10 is a top view illustrating a trajectory of each nozzle providedin the resist coating module.

FIG. 11 is a chart illustrating an operation of the resist coatingmodule.

FIG. 12 is a chart illustrating an operation of the resist coatingmodule.

FIG. 13 is an operational view illustrating the operation of the resistcoating module.

FIG. 14 is an operational view illustrating the operation of the resistcoating module.

FIG. 15 is an operational view illustrating the operation of the resistcoating module.

FIG. 16 is an operational view illustrating the operation of the resistcoating module.

FIG. 17 is an operational view illustrating the operation of the resistcoating module.

FIG. 18 is an operational view illustrating the operation of the resistcoating module.

FIG. 19 is an operational view illustrating the operation of the resistcoating module.

FIG. 20 is an operational view illustrating the operation of the resistcoating module.

FIG. 21 is an operational view illustrating the operation of the resistcoating module.

FIG. 22 is an operational view illustrating the operation of the resistcoating module.

FIG. 23 is an explanatory view illustrating another processing examplein the resist coating module.

DETAILED DESCRIPTION

Reference will now be made in detail to various embodiments, examples ofwhich are illustrated in the accompanying drawings. In the followingdetailed description, numerous specific details are set forth in orderto provide a thorough understanding of the present disclosure. However,it will be apparent to one of ordinary skill in the art that the presentdisclosure may be practiced without these specific details. In otherinstances, well-known methods, procedures, systems, and components havenot been described in detail so as not to unnecessarily obscure aspectsof the various embodiments.

FIG. 1 illustrates a substrate processing apparatus 1 including a resistcoating module 2 which is an embodiment of a coating apparatus of thepresent disclosure. A carrier 11 that stores a plurality of wafers W istransferred to the substrate processing apparatus 1. In addition, thesubstrate processing apparatus 1 includes a temperature adjustmentmodule 12 and a transfer mechanism 13. The transfer mechanism 13transfers the wafer W in the order of the carrier 11, the temperatureadjustment module 12, the resist coating module 2, and the carrier 11.The temperature adjustment module 12 adjusts the temperature of thewafer W to a predetermined temperature such that the wafer W isappropriately processed by the resist coating module 2. Then, when thetemperature adjustment of the wafer W is completed and the wafer W canbe unloaded, the temperature adjustment module 12 outputs apredetermined signal (hereinafter referred to as an “unload signal”) toa controller 100 to be described later.

Next, the resist coating module 2, which is a coating apparatus, will bedescribed with reference to a plan view of FIG. 2. The resist coatingmodule 2 discharges a thinner, which is a first processing liquid, ontothe wafer W, and discharges a resist, which is a second processingliquid, after the discharge of the thinner, thus forming a resist filmas a costing film on the wafer W. The above-described discharge of thethinner is performed in order to execute a cleaning process for removingforeign substances on a front surface of the wafer W, and also serves aspre-wetting for increasing the wettability of the resist on the frontsurface of the wafer W. The above-described discharge of the resist isperformed by selecting one of a plurality of nozzles, which dischargedifferent types of resists, respectively, whereby a resist filmcorresponding to the lot of the wafer W can be formed. In addition, inthe resist coating module 2, after forming the resist film, edge beadremoval (EBR) for discharging a thinner, which is a third processingliquid, to the peripheral edge portion of the wafer W so as to remove anunnecessary portion of the resist film in a ring shape, is performed.

The resist coating module 2 includes a horizontally-elongatedrectangular housing 21. Inside the housing 21, processing parts 22A,22B, and 22C, each configured to process the wafer W, are provided inthis order in a horizontal direction. Each of the processing parts 22(22A to 22C) has a member configured to place the wafer W thereon so asto perform the cleaning process and the EBR. A resist supply mechanism 6shared by the three processing parts 22 is also provided inside thehousing 21. Assuming that the cleaning of the wafer W, the formation ofa resist film performed by the resist coating following the cleaning,and the EBR after the formation of the resist film are a series ofprocesses, the series of processes may be performed in the processingparts 22, respectively.

In FIG. 2, reference numeral 23 denotes transfer ports through whichwafers W are transferred to respective processing parts 22A, 22B, and22C. The transfer ports 23 are opened at positions corresponding torespective processing parts 22A, 22B, and 22C on a front sidewall of thehousing 21. The transfer ports 23 are opened and closed independently ofeach other by shutters 24, respectively. Hereinafter, descriptions willbe made assuming that the arrangement direction of the processing parts22 is a left-right direction, and that, unless otherwise specified, theright and left sides are respectively the right and left sides whenviewed from the rear side to the front side. The processing part 22A isdisposed on the left side, and the processing part 22C is disposed onthe right side.

Descriptions will be made with reference to FIG. 3, which is aperspective view of the interior of the housing 21. The processing parts22A to 22C are configured similarly to each other. Hereinafter, as arepresentative example, the processing part 22A will be described withreference to a vertical cross-sectional side view of FIG. 4. Theprocessing part 22A includes a cup 31A that is open at the top andaccommodates the wafer W in an internal holding region of the processingpart 22A. In FIG. 4, reference numeral 32 denotes a drain port providedin the cup 31A, and in FIG. 4, reference numeral 33 denotes an exhaustport for evacuating the interior of the cup 31A during processing of thewafer W. A spin chuck 34A, which is a substrate holder, is providedinside the cup 31A, and suctions the center of a rear surface of thewafer W so as to hold the wafer W horizontally. The lower side of thespin chuck 34A is connected to a rotation driver 35. By the rotationdriver 35, the spin chuck 34A rotates around a vertical axis togetherwith the wafer W held thereon. Inside the cup 31A, three pins 37 (onlytwo pins are illustrated in FIG. 4), which are moved up and down by alifting mechanism 36, are provided, and deliver the wafer W between thetransfer mechanism 13 of the wafer W and the spin chuck 34A.

The processing part 22A includes a peripheral processing mechanism 4Aconfigured to performing EBR and a processing mechanism 5A configured toperform a cleaning process. Hereinafter, the peripheral processingmechanism 4A will be described. The peripheral processing mechanism 4Aincludes a linear motion mechanism 41, a lifting mechanism 42, an arm43, a nozzle (hereinafter, referred to as a peripheral nozzle) 44A, anda cup-shaped standby part 45A. The linear motion mechanism 41 isprovided to extend in the left-right direction in the right region onthe rear side of the cup 31A. The lifting mechanism 42 is connected tothe linear motion mechanism 41. The lifting mechanism 42 is configuredto be capable of linear movement horizontally in the left-rightdirection by the linear motion mechanism 41. The base end of the arm 43is connected to the lifting mechanism 42, and the distal end side of thearm 43 extends forward. The arm 43 is vertically moved up and down bythe lifting mechanism 42. The peripheral nozzle 44A, which is a thirdnozzle, is provided below a distal end of the arm 43 so as to dischargea thinner, for example, obliquely with respect to a horizontal plane andtoward the rear side in a plan view. The discharge of the thinner isperformed after the cleaning and the formation of the resist film, thatis, when the processing liquid is not discharged from an individualnozzle 55 and a resist nozzle 71 to be described below. The peripheralnozzle 44A is connected to a thinner supply mechanism (not illustrated)configured to supply the thinner to the peripheral nozzle 44A via apipe.

The standby part 45A, which is a third standby part, is provided in aregion on the right side with respect to the center of the cup 31A inthe front-rear direction. In cooperation between the linear motionmechanism 41 and the lifting mechanism 42, the peripheral nozzle 44Amoves between a standby position within the standby part 45A and athinner discharge position (a third discharge position) above theperipheral edge of the wafer W at a predetermined height from the waferW within the cup 31A. When not used, the peripheral nozzle 44A waits atthe standby position described above.

Next, a processing mechanism 5A will be described. The processingmechanism 5A includes a lifting mechanism 51, a rotation mechanism 52,an arm 53, a nozzle (hereinafter, referred to as a peripheral nozzle)54A, and a cup-shaped standby part 55A. The lifting mechanism 51 and therotation mechanism 52 are provided on the left side of the center of thecup 31A in the front-rear direction. The rotation mechanism 52 isconnected to the lifting mechanism 51 and moves vertically up and downby the lifting mechanism 51. The base end of the arm 53 is connected tothe rotation mechanism 52, and a distal end side of the arm 53 extendsin a lateral direction. The rotation mechanism 52 rotates the arm 53around a vertical rotation shaft 50 (see FIG. 2) provided on the baseside of the arm 53. That is, the distal end side of the arm 53 rotatesaround the rotation shaft 50, and the rotation mechanism 52 constitutesa turning mechanism. The individual nozzle 54A, which is a secondnozzle, is provided below the distal end of the arm 53 so as todischarge the thinner vertically downward. The downstream end of thepipe 56 is connected to the individual nozzle 54A, and the upstream endof the pipe 56 is connected to a thinner supply mechanism 57 configuredto supply the thinner to the individual nozzle 54A.

A box body 58 surrounding the downstream side of the pipe 56 is providedat the distal end of the arm 53. Temperature-adjusted water is suppliedto a space outside the pipe 56 within the box body 58. One end of asupply pipe 47 and one end of a discharge pipe 48 are connected to thebox body 58 (see FIG. 4). The other end of the supply pipe 47 and theother end of the discharge pipe 48 are connected to a circulation flowforming mechanism 49. The circulation flow forming mechanism 49 adjuststhe temperature of the water supplied from the discharge pipe 48, andsupplies the water to the space within the box body 58 via the supplypipe 47. That is, the circulation flow forming mechanism 49 constitutesa chiller, and the temperature of the thinner passing through the pipe56 is adjusted by the supply of the temperature-adjusted water. That is,the temperature of the thinner discharged from the individual nozzle 54Ais adjusted.

On the left side of the cup 31A, the standby portion 55A, which is afirst standby part, is provided in a region closer to the front sidethan the center of the cup 31A in the front-rear direction. Incooperation between the lifting mechanism 51 and the rotation mechanism52, the individual nozzle 54A moves between a standby position withinthe standby part 55A and a discharge position (a second dischargeposition) above the center of the wafer W at a predetermined height fromthe wafer W within the cup 31A. When not used, the individual nozzle 54Awaits at the standby position within the standby part 55 describedabove.

As described above, each of the processing parts 22B and 22C isconfigured similarly to the processing part 22A. Components of theprocessing parts 22B and 22C that are the same as those of theprocessing part 22A are denoted by the same reference numerals as thoseused in the processing part 22A. However, the alphabetic charactersadded after the numerals are indicated using different alphabeticcharacters among the processing parts. Letter B is additionallyindicated in the reference numeral of the processing part 22B, andletter C is additionally indicated in the reference numeral of theprocessing part 22C. In the following description, the rear region ofthe cups 31A to 31C inside the housing 21 is denoted by 38.

Next, the resist supply mechanism 6 will be described. The resist supplymechanism 6 includes a standby part 61, ten resist nozzles 71, and anozzle transfer mechanism 63. The standby part 61, which is a secondstandby part, is disposed behind the cup 31B. The standby part 61 isconfigured as a stage that extends backward and forward in the rearregion 38 and has a rear side oriented to the right side in a plan view.In addition, ten recesses (see FIG. 4) are formed in the upper portionof the standby part 61 at intervals along the lengthwise direction ofthe stage. Each recess is configured as a standby position 62 at whichthe resist nozzle 71 is accommodated and stands by. By supplying athinner to each standby position 62, it is possible to prevent drying ofthe resist in the resist nozzle 71 during standby.

The reason why the standby part 61 is provided behind the central cup31B among the cups 31A to 31C as described above is to prevent a largedifference in distances between the standby part 61 and the processingparts when the resist nozzles 71 are transferred onto the wafers W fromthe standby part 61. More specifically, by suppressing the difference inthe distances, the tension applied to the pipes 74 connected to theresist nozzles 71 to be described later is prevented from varying foreach process in each processing part 22. Thus, the variation in thestate of the liquid flow discharged between the processes in eachprocessing part 22 is suppressed.

The resist is discharged vertically downward from each of the resistnozzles 71, which are the second nozzles shared by each of theprocessing parts 22. As will be described later, the resist nozzles 71are configured to have visible-light translucency for capturing internalimages of the resist nozzles 71. Block-shaped held portions 72, held bythe nozzle transfer mechanism 63 to be described later, are provided onthe resist nozzles 71, respectively. In addition, one end of a flexiblepipe 74 is connected to each resist nozzle 71 from the left side. Theupstream side of each pipe 74 is curved to be directed downward and thendirected rightward, and a portion extending rightward is fixed to thefloor. Reference numeral 75 in FIG. 3 denotes a fixing portion forperforming the fixing. A resist supply mechanism (not illustrated) isconnected to the upstream side of each pipe 74. The resist supplymechanism is provided for each pipe 74. The resist supply mechanismssupply different types of resists to the resist nozzles 71 via the pipes74, respectively.

Next, the nozzle transfer mechanism 63, which is a driver of the secondnozzles, will be described. The nozzle transfer mechanism 63 includes alinear motion mechanism 64, a lifting mechanism 65, a lifting part 66,and an arm (hereinafter, referred to as a “shared arm”) 67 extending inthe horizontal direction. The linear motion mechanism 64 is provided soas to extend in the left-right direction on the rear side of the standbypart 61. The linear motion mechanism 64 is provided with the liftingmechanism 65. The lifting mechanism 65 is configured to be movable leftand right by the linear motion mechanism 64. The base end of the liftingpart 66 extending back and forth is connected to the lifting mechanism65. The base end of the shared arm 67 is provided at the distal end ofthe lifting part 66. A vertical rotation shaft 68 (see FIG. 2) isprovided at the base end of the shared arm 67. The shared arm 67 isrotated around the rotation shaft 68 by a rotation mechanism (notillustrated). That is, the distal end side of the shared arm 67 swivelsabout the rotation shaft 68.

An attachment/detachment mechanism 60 for attaching/detaching the heldportions 72 of the resist nozzles 71 is provided below the distal end ofthe shared arm 67, so that the resist nozzle 71 can be freely changed inthe standby part 61. For example, a concave portion is formed, forexample, in each of the upper portions of the held portions 72, and theabove-mentioned attachment/detachment mechanism is configured as aprotrusion that enters the concave portion. For example, a smallprotrusion is provided on the side surface of the protrusion, and thusthe attachment/detachment is performed when the small protrusion isprotruded and retracted so as to switch between an engagement state inwhich the small protrusion is engaged with the side surface of theconcave portion and a release state in which the engagement is released.

In cooperation between the linear motion mechanism 64, the liftingmechanism 65, and the shared arm 67, each of the resist nozzles 71 maymove between a standby position in the standby part 61 and a dischargeposition (a second discharge position) at a predetermined height fromthe front surface of the wafer W within each of the cups 31 (31A to 31C)and above the center of each wafer. When the resist nozzles 71 aretransferred onto the wafer W, the resist nozzles 71 are transferred byrotating the shared arm 67 clockwise in a plan view from the state inwhich the distal end thereof extends leftwards with respect to the baseend thereof in the state in which the lifting mechanism 65 is stopped ata position corresponding to each of the processing parts 22A to 22C. Inaddition, in transferring the resist nozzles 71 between the standby part61 and the processing parts 22 and between the processing parts 22, whenthe lifting mechanism 65 is moved left and right by the linear motionmechanism 64, the shared arm 67 is oriented such that the distal endthereof is directed toward the right side and located in the rear region38. That is, the shared arm 67 moves so as not to hinder the processingin each processing part 22.

The above-described shared arm 67 will be described with reference toFIG. 5A which is a perspective view on the distal end side and FIG. 5Bwhich is a schematic top view. On the base side of the shared arm 67,support portions 81 are provided to extend to the left and right whenviewed in the direction in which the shared arm 67 extends. The left andright do not always coincide with the left and right in the longitudinaldirection of the housing 21 described above. A first illumination 82,which is a light-emitting diode (LED), is provided at a distal end ofeach support portion 81. Each first illumination 82 may have a planethat emits light in a relatively wide range, and may emit light towardthe resist nozzle 71 held by the shared arm 67. Since the firstilluminations 82 are provided apart from each other, light is emitted tothe resist nozzle 71 in different directions. More specifically, in aplan view, light is emitted toward the resist nozzle 71 from each of tworegions separated by a straight line LO connecting a camera 84 (to bedescribed later) and the resist nozzle 71 (indicated by a dotted arrowin FIG. 5B). Specifically, the straight line connecting the camera 84and the resist nozzle 71 is, for example, an optical axis of the camera84, and is a straight line including an extension of the straight linebetween the camera 84 and the resist nozzle 71, in addition to thestraight line between the camera 84 and the resist nozzle 71. The reasonthat the light is emitted in the different directions is to equallyrecognize both of left and right sides of the inner wall of the resistnozzle 71 in order to specify the range of the liquid existing in theresist nozzle 71 in an image acquired by the camera 84 to be describedlater. That is, when the liquid is present in the resist nozzle 71, onthe inner wall of the resist nozzle 71, a bright and dark contrast isgenerated between a portion that is in contact with the liquid and aportion that is not in contact with the liquid, so that the two portionscan be distinguished. Therefore, even if it is not possible to clearlyspecify the upper and lower surfaces of the liquid in the image, theabove-mentioned contrast makes it possible to specify the range in whichthe liquid is present from the range of the inner wall, which is incontact with the liquid. Further, by equally recognizing the inner wallon both of the left and right sides of the liquid, it is possible tospecify the existing range of the liquid with higher reliability.

In addition, a support portion 83 is provided on the distal end side ofthe shared arm 67. The support portion 83 is provided with the camera 84and a second illumination 85, which is an LED. The optical axis of thecamera 84 is obliquely directed downward such that the resist nozzle 71and a region below the resist nozzle 71 are included in the field ofview of the camera 84. The second illumination 85 emits light toward thebase end side of the shared arm 67 and obliquely downward. This lightforms a relatively small irradiation spot at the upper end of the resistnozzle 71. The arrows in FIG. 6 indicate optical paths inside the resistnozzle 71 of the light supplied from the second illumination 85 to theresist nozzle 71 as described above. As illustrated in FIG. 6, the lighttravels downward while being reflected between an outer peripheralsurface of the flow path 70 in the resist nozzle 71 and an outerperipheral surface of the resist nozzle 71. Since the light passesthrough the interior of the resist nozzle 71 in this manner, a clearimage of the interior of the resist nozzle 71 is obtained. In addition,as described above, since the illuminations and the cameras are providedon the shared arm 67, which is independent of a mechanism provided foreach of the processing parts 22A to 22C and is shared by the respectiveprocessing parts 22A to 22C, it is possible to reduce the number ofilluminations and cameras that are used and to reduce the space requiredfor installation thereof (space saving).

For example, image capturing is performed by the camera 84, which is animage capturing part, from a time point slightly before the resist isdischarged from the resist nozzle 71 and until the discharge of theresist is terminated. During this image capturing, for example, an imageof the resist nozzle 71 may be acquired by simultaneously emitting lightfrom the first illuminations 82 and the second illumination 85.Alternatively, the timing of emitting light from the first illuminations82 and the timing of emitting light from the second illumination 85 maybe shifted from each other and an image of each timing may be acquired.Image data captured by the camera 84 is transmitted to the controller100 to be described later. Based on the acquired images, the controller100 may detect the presence/absence of dirt attached to the resistnozzle 71, the resist dripping from the resist nozzle 71, the positionof the liquid surface inside the nozzle, the presence/absence ofinterruption of liquid flow of the resist caused by bubbles, and thelike, and may determine whether or not there is an abnormality based onthe result of detection. A combination of the first illuminations 82 andthe second illumination 85 constitutes an illumination part, and thesecond illumination 85 is configured as an upper illumination member. Byproviding the second illumination for emitting light from above inaddition to the first illuminations 82, the upper surface and the lowersurface of the liquid inside the resist nozzle 71 can be seen from theimage while suppressing the image from being difficult to see due to themist of the discharged liquid and contamination caused by scattering. Inaddition, the lower surface of the liquid can be recognized byillumination from above if the height thereof is small enough to stay inthe nozzle.

The resist discharge position of the resist nozzle 71 and the thinnerdischarge position of the individual nozzle 54 (54A to 54C) are locatedon the center of the wafer W and become common discharge positionsoverlapping each other. Referring to the operation of these nozzles, inorder to shorten the processing time by supplying resist R to the waferW immediately after the cleaning of the wafer W, while the individualnozzle 54 is discharging thinner B1 onto the wafer W, the resist nozzle71 waits at an immediately-previous standby position, which is slightlyshifted in the horizontal direction from the discharge position of theresist R (FIG. 7). When the individual nozzle 54 terminates thedischarge of the thinner B1 and is moved and retracted in the horizontaldirection from the discharge position of the thinner B (FIG. 8), inorder to avoid interference between the nozzles, the resist nozzle 71moves in the horizontal direction slightly after this movement and stopsat the discharge position of the resist R. That is, the liftingmechanism 65 does not move up and down, and only by the turningoperation of the shared arm 67, the resist nozzle 71 moves from theimmediately-previous standby position to the discharge position, and thedischarge of the resist R is started (FIG. 9).

It is assumed that the movement trajectory of the individual nozzle 54A,the movement trajectory of the resist nozzle 71, and the movementtrajectory of the peripheral nozzle 44A when processing the wafer W inthe processing part 22A are D1, D2, and D3, respectively. In FIG. 10,for the sake of convenience in illustration, the movement trajectory ofthe discharge port of each nozzle is indicated by a straight line or acurve. As described above, since the discharge position of the resistnozzle 71 and the discharge position of the individual nozzle 54Aoverlap, the movement trajectory D1 and the movement trajectory D2overlap on the center of the wafer W. However, the movement trajectoriesD1, D2, and D3 do not overlap each other except for the overlapping ofthe movement trajectories on the center of the wafer W. Since themovement trajectories D1 and D2 are set in this way, theimmediately-previous standby position of the resist nozzle 71 describedabove is a position that does not overlap the movement trajectory D1 ofthe individual nozzle 54A.

As the overlap of the movement trajectories D1 to D3 increases, it isnecessary to set the operation order and timing of each nozzle in detailin order to prevent interference between the nozzles. That is, themovement control of each nozzle becomes complicated. However, asdescribed above, the movement trajectories D1 to D3 do not overlapexcept for the overlapping of the movement trajectories D1 and D2 at thecenter of the wafer W. Since the overlapping of the movementtrajectories D1 to D3 is suppressed as described above, the movementcontrol of each nozzle is suppressed from being complicated. Althoughthe movement trajectory of each nozzle when processing the wafer W usingthe processing part 22A is illustrated as a representative example, eachnozzle also draws the same movement trajectory when another processingpart 22 processes a wafer W. That is, in the processing parts 22B and22C, the movement trajectories of the nozzles do not overlap each otherin a plan view, except for the center of the wafer W. The thinnerdischarge position of the peripheral nozzle 44 of each processing part22 may be any position on the wafer W. The expression “on the wafer W”means above the wafer W, and is not limited to overlapping the wafer Win a plan view as illustrated in each figure.

However, the thinner discharge position of each individual nozzle 54(54A to 54C) is located on the center of the wafer W as described above.Accordingly, the distance between the standby portion 55 (55A to 55C) ofthe individual nozzle 54 (54A to 54C) provided outside the cup 31 (31Ato 31C) and the discharge position in a plan view is relatively long.Therefore, when the movement between the standby portion 55 of theindividual nozzle 54 and the discharge position performed via the arm 53is performed by a linear motion mechanism which moves the peripheralnozzle 44 (44A to 44C), instead of the rotation mechanism 52, the lengthof the linear motion mechanism may increase. That is, in order toinstall the linear motion mechanism on the lateral side of the cup 31, alarge space is required in the lateral direction. When the individualnozzle 54 is moved by the linear motion mechanism as described above, itmay be considered that the space may be unnecessary by disposing thelinear motion mechanism above the cup 31. In such a configuration,particles generated from the linear motion mechanism may fall and adhereto the wafer W. Thus, such an arrangement is not desirable. Therefore,in order to prevent the resist coating module 2 from increasing in size,it is effective that the movement of the individual nozzle 54 in thelateral direction is performed by the rotation mechanism 52 as describedabove.

Meanwhile, the discharge position of the peripheral nozzle 44 is locatedon the peripheral edge portion of the wafer W. Accordingly, since thedistance between the standby portion 45 (45A to 45C) of the peripheralnozzle 44 provided outside the cup 31 and the discharge position in aplan view is relatively short, the length of the linear motion mechanism41 is relatively small even in the configuration in which the peripheralnozzle 44 is moved by the linear motion mechanism 41 as described above.In addition, the resist film on the peripheral edge portion of the waferW is removed in a ring shape through EBR using the peripheral nozzle 44,and it is assumed that the setting of the removal width of the resistfilm has been changed. As described above, the peripheral nozzle 44 isprovided on the arm 43 in an inclined state. However, when theperipheral nozzle 44 is horizontally moved linearly by the linear motionmechanism 41, the thinner discharge direction with respect to therotation direction of the wafer W is not changed even if the setting ofthe removal width has been changed as described above.

However, assuming that the movement of the peripheral nozzle 44 via thearm 43 is performed by the rotation mechanism that moves the individualnozzle 44 instead of the linear motion mechanism 41, the thinnerdischarge direction with respect to the rotation direction of the waferW is changed by changing the setting of the removal width. In otherwords, in addition to the fact that the liquid landing position of thethinner changes in the radial direction of the wafer W, the change inthe discharge direction may cause a large change in the centrifugalforce at the liquid landing position, and the liquid splashing from theliquid landing position may increase. Therefore, it may be consideredthat it is necessary to adjust the inclination of the peripheral nozzle44 each time the setting of the removal width is changed. Therefore,from the viewpoint of suppressing the trouble of such adjustment, it ispreferable that the peripheral nozzle 44 be moved by the above-describedlinear motion mechanism 41.

Since the arm 53 supporting the individual nozzle 54 is turned by therotation mechanism 52, the region required for the movement of the arm53 (the turning region of the arm 53) is relatively large. It is assumedthat the standby part 55 of the individual nozzle 54 and the rotationmechanism 52 are disposed on the right side of the cup 31 similarly tothe standby part 45 of the peripheral nozzle 44. In this case, since theregion required for the movement of the arm 53 is large as describedabove, it is necessary to secure a space for avoiding interferencebetween the peripheral nozzle 44 and the arm 43 supporting theperipheral nozzle 44, and thus there is a concern that the module may beincreased in size.

When both the standby part 55 of the individual nozzle 54 and therotation mechanism 52 are disposed behind the cup 31, it will benecessary to secure the space for avoiding interference with the resistnozzle 71 and the shared arm 67 supporting the resist nozzle 71.Therefore, there is a possibility that the module is also increased insize. In addition, it is assumed that both the standby part 55 of theindividual nozzle 54 and the rotation mechanism 52 are disposed in frontof the cup 31. In this case, it is necessary to make the arm 53 stand byat a high position such that the arm 53 does not to interfere with thewafer W loaded into and unloaded from the processing part 22 via thetransfer port 23. Thus, there is a concern that the height of the moduleincreases and the module is also enlarged.

However, in the resist coating module 2, the standby part 55 of theindividual nozzle 54 and the rotation mechanism 52 are disposed on oneof the left and right sides of the cup 31, and the standby part 45 ofthe peripheral nozzle 44 is disposed on the other of the left and rightsides. By adopting such a layout, it is possible to prevent interferencebetween the components of the module, such as respective arms andnozzles as described above, and interference between the components ofthe module and the wafer W. As a result, it is possible to prevent themodule from being bulky, which is preferable.

In the resist coating module 2, as described above, with respect to therotation mechanism 52 of the individual nozzle 54 and the standby part55 provided on the lateral side of the cup 31, the rotation mechanism 52is located on the rear side and the standby part 55 is located on thefront side. With such an arrangement, as illustrated in FIGS. 7 to 9,the resist nozzle 71 may be moved to the discharge position from theside opposite the side on which the individual nozzle 54A is caused tobe retracted from the discharge position. Accordingly, when theindividual nozzle 54 and the resist nozzle 71 are moved in this manner,interference between the nozzles does not occur, and after the dischargeof the thinner by the individual nozzle 54, the resist nozzle 71 can bepromptly disposed at the discharge position to start the discharge ofthe resist. Thus, the throughput can be improved.

Next, the controller 100 (see FIG. 2) constituting the resist coatingmodule 2 will be described. The controller 100 is configured by acomputer. The controller 100 has a program storage part (notillustrated). The program storage part stores a program in whichinstructions (a step group) are set such that the resist coating module2 operates as described above and as will be described later and aprocess is performed in each processing part 22. Such operations areperformed by outputting control signals from the controller 100 to eachpart of the resist coating module 2 by the program. The above-describedprogram is stored in the program storage part in the state of beingstored in a storage medium such as a hard disc, a compact disc, amagneto-optical disc, a memory card, a DVD or the like.

In the resist coating module 2, for example, the wafers W may berepeatedly loaded into the processing parts 22A, 22B, and 22C in thatorder by the above-described transfer mechanism 13. A series ofprocesses including cleaning of the wafers W, formation of a resistfilm, and EBR, are performed in each processing part 22. When an unloadsignal for the wafer W is output from the temperature adjustment module12, the above program sets a processing schedule for the wafer W(scheduled operations of each part of the module for performing theprocesses on the wafer W). Then, the program outputs the above controlsignals such that the series of processes are performed based on the setprocessing schedule.

FIG. 11 is a time chart showing operation timing of the individualnozzle 54 and the resist nozzle 71 in the processing schedule set asdescribed above. Hereinafter, each operation process in continuousperiods L1 to L6 shown in this time chart will be described. The wafer Wis rotating at a predetermined number of rotations during these periodsL1 to L6. The start point of the period L1 is the start point of theseries of processes described above. In this period L1, the individualnozzle 54 is moved from the standby part 55 to the discharge position.In the period L2, thinner B1 is discharged onto the rotating wafer Wfrom the individual nozzle 54 moved to the discharge position.

In the period L3, the resist nozzle 71 moves from the rear region 38 tothe immediately-previous standby position of the wafer W described withreference to FIG. 8. As will be specifically described later, themovement to the immediately-previous standby position of the wafer Wincludes a case where the resist nozzle 71 moves from the standby part61 and the case where the resist nozzle 71 that has terminatedprocessing of another wafer W moves to the standby part 61 from theoutside. The discharge of the thinner B1 is continuously performed. Atthe start point of the period L4, the discharge of the thinner B1 isstopped. During the period L4, retraction of the individual nozzle 54from the discharge position and movement of the resist nozzle 71 to thedischarge position are sequentially performed as described withreference to FIGS. 8 and 9. Then, the individual nozzle 54, which wasretracted from the discharge position, moves toward the standby part 55.

In the period L5, the resist R is discharged from the resist nozzle 71at the discharge position. Then, at the start point of the period L6,the discharge of the resist R stops, and the resist nozzle 71 isretracted to the rear region 38. Regarding the retraction of the resistnozzle 71 to the rear region 38, there are the case where the resistnozzle 71 is returned to the standby position of the standby part 61 andthe case where the resist nozzle 71 is not returned to the standbyposition, depending on the transfer state of the subsequent wafer W asdescribed later. The controller 100 constitutes a determinationmechanism configured to determine the transfer path of the resist nozzle71. In this example, since the discharge time of the cleaning thinner islonger than the discharge time of the resist, the period L2+L3 is largerthan the period L5. Since the same process is performed on each wafer W,the lengths of the periods L1 to L6 in the processes of respectivesubstrates are the same. The process from the start of the period L1 inwhich the individual nozzle 54 starts moving from the standby part 44 tothe end of the period L5 in which the discharge of the resist from theresist nozzle 71 is terminated may be referred to as a continuousprocess.

When the transfer interval of wafers W to the resist coating module 2 isrelatively short, processing schedules of other processing parts 22 areset such that, in parallel with a series of processes in one processingpart 22 to which a wafer W has been previously transferred, a series ofprocesses is performed in another processing part 22 to which the nextwafer W is transferred. More specifically, the processing schedule isset such that the periods during which the above-described continuousprocesses are performed between the processing parts 22 overlap.

As described above, the resist coating module 2 has a configuration inwhich the resist nozzle 71 and the shared arm 67 are shared by therespective processing parts 22. Therefore, the processing schedule ofanother processing part 22 is set such that while one of the processingparts 22 is using the resist nozzle 71 and the shared arm 67, a processin which the resist nozzle 71 and the shared arm 67 are not used isperformed in another processing part 22. That is, based on theprocessing schedule of one processing part 22 set earlier, theprocessing schedule of another processing part 22 is set.

Setting of the processing schedule of another processing part 22 will bedescribed in more detail with reference to FIG. 12. It is assumed thatthe end time of the period L6 at which the operation of the resistnozzle 71 and the shared arm 67 is terminated in one processing part 22is t1, and the start time of the period L3 at which the operation of theresist nozzle 71 and the shared arm 67 starts in another processing part22 is t2. The processing schedule of another processing part 22 is setsuch that the time after the above-mentioned time t1 becomes theabove-mentioned time t2, and an interval A1 between the time t1 and thetime t2 is set to be the shortest length within the range of a set timeor more. In addition, the set time is, for example, a time longer than 0seconds.

That is, as a wafer transfer interval from the transfer of a wafer W (afirst substrate) to one processing part 22 until the transfer of a waferW (a second substrate) to another processing part 22 becomes shorter,the interval A1 becomes shorter, and the time during which the wafers Ware processed in parallel in the one processing part 22 and anotherprocessing part 22 becomes longer. However, the interval A1 is not setto be shorter than the set time. As the transfer interval becomeslonger, the interval A1 becomes longer. Depending on the transferinterval, processes are not performed in parallel between the processingparts 22, and after a series of processing is terminated in oneprocessing part 22, a series of processes is started in anotherprocessing part 22.

Since the wafers W are processed in respective processing parts 22 inthe same manner, setting the interval A1 in this manner also meanssetting the start interval of processing of the wafers W between theprocessing parts 22. When the unload signal is output from thetemperature adjustment module 12 as described above, a processingschedule is set. Meanwhile, it is assumed that after the processing isstarted by one processing part 22, a next unload signal is generated ata short interval. In this case, since the interval A1 is set asdescribed above, the start timing of the period L1 in the anotherprocessing part 22 is set so as to go back a predetermined time A2 fromthe termination timing of the period L5 at which the resist dischargeprocess is terminated in the one processing part 22. That is, during theprocessing of a wafer W in one processing part 22, depending on thetiming at which the resist discharge process on the wafer W is to beterminated (the timing at which the continuous process is to beterminated), the timing at which the continuous process of a wafer W isto be started in another processing part 22 is determined.

In FIG. 12, there is shown a time chart showing the periods L1 to L6when the processing schedule in the processing part 22B is set assumingthat one processing part 22 is the processing part 22A and anotherprocessing part 22 is the processing part 22B. In this example, theinterval A1 is set to be the set time, that is, the minimum time.Setting the set time of the interval A1 to a time longer than 0 secondsenables the process in another processing part 22 to be performedwithout any inconvenience even if the actual process in one processingpart 22 is delayed with respect to the processing schedule. In addition,the transfer mechanism 13 operates such that the wafers W for which theprocessing schedule in the processing parts 22 is set as described aboveare transferred from the temperature adjustment module 12 according tothe start timing of the processing schedule. Then, after the transfer ofthe wafers W to the processing parts 22, the processes are startedimmediately based on the processing schedule.

By setting the processing schedule as described above, the period fromthe end of the discharge of the thinner to the start of the discharge ofthe resist in each processing part 22 has a preset length. If thisperiod is too long, the thinner may volatilize from the wafer W, and ifthis period is too short, the resist nozzle 71 may not move to thedischarge position in time. That is, the processing schedule in eachprocessing part 22 is set such that the-above mentioned problems do notoccur. That is, the start timing of the series of processes in anotherprocessing 22 is determined such that the time from the end of thedischarge of the thinner to the start of the discharge of the thinner inthe one processing part 22 is not delayed.

The operation in the period L6 in the time charts of FIGS. 11 and 12will be additionally described. It is assumed that at a predeterminedtiming during the processing of the wafer W according to the processingschedule, for example, at the start of the period L6, the processingschedule of the next wafer W has not been set, that is, there is notransfer schedule of the next wafer W to the resist coating module 2. Inthis case, the resist nozzle 71, which has been held by the shared arm67 and has discharged the resist to the wafer W, is transferred to thestandby position 62 in the standby part 61. This prevents the resistfrom drying within the resist nozzle 71. Meanwhile, when the processingschedule for the next wafer W has been set at the start of the periodL6, the resist nozzle 71 held by the shared arm 67 is located, forexample, above the standby position 62 rather than being transferred tothe standby position 62. As described above, when the transfer intervalof the wafer W to the processing part 22 is short and the resistdischarge interval is short, the drying in the resist nozzle 71 isunlikely to occur. In this case, the operation of raising and loweringthe resist nozzle 71, required for the movement to the standby position62 and the movement from the standby position 62, may be omitted. As aresult, it is possible to improve throughput. In addition, as describedabove, since the movement destinations of the resist nozzle 71 in theperiod L6 are different, the movement origins of the resist nozzle 71 inthe period L3 are made different.

Hereinafter, an operation example of the resist coating module 2 thatsequentially transfers the wafers W to the processing parts 22A to 22Cto perform processes from the state where no wafer W has beentransferred to the processing parts 22A to 22C will be described. Asdescribed above, in practice, the wafers Ware repeatedly transferred tothe processing parts 22A to 22C. However, here, for the sake of avoidingcomplexity of description, it is assumed that only three wafers W of thesame lot are continuously transferred to the resist coating module 2.These wafers W are denoted by W1, W2, and W3 in the order of loadinginto the resist coating module 2. Further, in this description, it isassumed that each of the wafers W1 to W3 can be unloaded from thetemperature adjustment module 12 at a relatively short interval, andthat the interval A1 described in FIG. 12 is the minimum.

In the state in which the peripheral nozzle 44, the individual nozzle54, and the resist nozzle 71 are kept in standby at each of standbyparts (FIG. 13), an unload signal of the wafer W1 is output from thetemperature adjustment module 12, and a processing schedule in theprocessing part 22A is set. Then, the wafer W1 is transferred to theprocessing part 22A where the wafer W1 is held and rotated by the spinchuck 34A, and a process is started according to the processingschedule. That is, the movement of the individual nozzle 54A from thestandby part 55 to the discharge position and the discharge of thethinner B1 from the individual nozzle 54A to the center of the wafer W1,which are described as the operations in the periods L1 and L2 in thecharts of FIGS. 11 and 12, are sequentially performed. By a centrifugalforce, the thinner B1 is spread over the entire front surface of thewafer W1 to clean the front surface of the wafer W1.

While the process is being performed in the processing part 22A in thismanner, an unload signal of the wafer W2 is output from the temperatureadjustment module 12, and a processing schedule in the processing part22B is set. Then, the operation in the period L3 is performed in theprocessing part 22A. That is, the shared arm 67 holds one resist nozzle71 and transfers the resist nozzle 71 to the immediately-previousposition of the wafer W1. Meanwhile, the wafer W2 is transferred to theprocessing part 22B where the wafer W is held and rotated by the spinchuck 34B (FIG. 14). Thereafter, in the processing part 22A, as theoperation in the period L4, the movement of the individual nozzle 54from the discharge position to the standby part 55 and the movement ofthe resist nozzle 71 to the discharge position are sequentiallyperformed. Meanwhile, a process is started in the processing part 22Baccording to the processing schedule, and the movement of the individualnozzle 54B from the standby part 55B to the discharge position, which isan operation in the period L1, is performed.

Then, in the processing part 22A, the resist R is discharged as theoperation in the period L5, and the resist R is spread over the entirefront surface of the wafer W1 by a centrifugal force (FIG. 15).Thereafter, the discharge of the resist R is stopped, and the resistnozzle 71 is retracted to the rear region 38 as the operation in theperiod L6, during which the resist R on the front surface of the waferW1 is dried to become a resist film R1. In addition, in the processingpart 22B, as the operation in the period L2, the discharge of thethinner B1 from the individual nozzle MB to the wafer W2 at thedischarge position is performed (FIG. 16). While the processes are beingperformed in the processing parts 22A and 22B in this manner, an unloadsignal of the wafer W3 is output from the temperature adjustment module12, and a processing schedule in the processing part 22C is set.

Thereafter, in the processing part 22A, the peripheral nozzle 44A movesto the processing position and discharges the thinner B2 to theperipheral edge portion of the wafer W1, and the resist film R1 on theperipheral edge portion of the wafer W1 is removed. In the meantime, inthe processing part 22B, the movement of the resist nozzle 71 to theimmediately-previous standby position is performed as the operation inthe period L3. Since the processing schedule of the processing part 22Bis set at the start of the period L6 in the processing part 22A, theresist nozzle 71 is directly moved to the immediately-previous standbyposition, rather than being transferred to the standby part 61, asdescribed above. Meanwhile, the wafer W3 is transferred to theprocessing part 22C where the wafer W3 is held and rotated by the spinchuck 34C (FIG. 17).

Thereafter, in the processing part 22A, the termination of the dischargeof the thinner B2 from the peripheral nozzle 44A and the retraction ofthe peripheral nozzle 44A to the standby part 45A are sequentiallyperformed, and the processed wafer W1 is unloaded from the processingpart 22A. In the meantime, in the processing part 22B, as the operationin the period L4, the retraction of the individual nozzle MB from thedischarge position and the movement of the resist nozzle 71 to thedischarge position are sequentially performed. Meanwhile, a process isstarted in the processing part 22C according to the processing schedule,and the movement of the individual nozzles MC from the standby part 55Cto the discharge position, which is an operation in the period L1, isperformed.

Then, in the processing part 22B, the discharge of the resist R isperformed as the operation in the period L5 (FIG. 18). Thereafter, thedischarge of the resist R is stopped, and the resist nozzle 71 isretracted to the rear region 38 as the operation in the period L6. Inthe meantime, the resist R on the front surface of the wafer W2 is driedto form a resist film RE In addition, in the processing part 22C, as theoperation in the period L2, the discharge of the thinner B1 from theindividual nozzle MC to the wafer W3 at the discharge position isperformed (FIG. 19).

Thereafter, in the processing part 22B, the peripheral nozzle 44B movesto the processing position and discharges the thinner B2 to theperipheral edge portion of the wafer W2, and the resist film R1 on theperipheral edge portion of the wafer W2 is removed. In the meantime, inthe processing part 22C, the direct movement of the resist nozzle 71 tothe immediately-previous standby position is performed as the operationin the period L3 (FIG. 20).

Thereafter, in the processing part 22B, the termination of the dischargeof the thinner B2 from the peripheral nozzle 44B and the retraction ofthe peripheral nozzle 44B to the standby part 45 are sequentiallyperformed, and the processed wafer W2 is unloaded from the processingpart 22A. In the meantime, in the processing part 22C, as the operationin the period L4, the retraction of the individual nozzle 54C from thedischarge position and the movement of the resist nozzle 71 to thedischarge position are performed, and as the operation in the period L5,the discharge of the resist R is performed (FIG. 21). After thedischarge of the resist R is terminated, the resist nozzle 71 isretracted to the rear region 38 as the operation in the period L6. Sincethe processing schedule for the next wafer W is not set, the resistnozzle 71 is transferred to the standby part 61 and waits at the standbyposition 62. Meanwhile, in the processing part 22C, the peripheralnozzle 44C moves to the processing position and discharges the thinnerB2 to the peripheral edge portion of the wafer W3, and the resist filmR1 on the peripheral edge portion of the wafer W3 is removed (FIG. 22).Thereafter, the wafer W3 is unloaded from the processing part 22C.

As described above, in the resist coating module 2, the individualnozzle 54 for performing the cleaning process and the peripheral nozzle44 for performing the EBR are provided for each processing part 22. Theresist nozzle 71, which performs the resist coating used after thecleaning process, is shared among the processing parts 22. Theindividual nozzle 54, the resist nozzle 71, and the peripheral nozzle 44may move independently of each other between the standby part outsidethe cup 31 and a position above the wafer W. Accordingly, while thecleaning process and/or the movement of the individual nozzles 54 forthe cleaning process are being performed in another processing part 22into which a wafer W is loaded later, the coating of the resist in oneprocessing part 22 into which the wafer W has been previously loadedand/or the movement of the resist nozzle 71 from one processing part 22to another processing part 22 may be performed. Further, regardless ofthe processing of the wafer W in another processing part 22, the EBRprocess may be performed in one processing part 22. Therefore, it ispossible to obtain high throughput for the resist coating module 2.

In particular, as described above, when the discharge time of thethinner by the individual nozzle 54 is longer than the discharge time ofthe resist by the resist nozzle 71, the discharge of the resist in oneprocessing part 22 and the movement of the resist nozzle 71 areperformed during the discharge time as described above, which isadvantageous since a decrease in throughput can be prevented. Further,as described above, in the resist coating module 2, the individualnozzles 54 are moved by the rotation mechanism 52, and the peripheralnozzles 44 are moved by the linear motion mechanism 41, whereby thespace for the module can be saved.

As described above, the coating apparatus of Patent Document 1 includesa large number of nozzles. All of these nozzles are shared by theprocessing parts (processing parts). Accordingly, since a process inanother processing part is performed after a process in one processingpart has been terminated, it is difficult to improve throughput. InPatent Document 1, each nozzle is similarly transferred from the rearside of a processing part to the respective processing part by thecommon nozzle transfer mechanism That is, Patent Document 1 does notteach the idea of preventing the apparatus from being bulky byselectively using movement performed by a linear motion mechanism andmovement performed by a rotation mechanism depending on nozzles inproviding the nozzles having different roles as in the presentdisclosure.

As described above, during the discharge of the thinner by theindividual nozzle 54, the resist nozzle 71 waits at theimmediately-previous standby position on the wafer W. Thus, it ispossible to quickly switch from the cleaning process to the resistdischarge process, thus more reliably increasing throughput. Inaddition, when the thinner discharge time is longer than the resistdischarge time and the difference between these discharge times isgreater, the resist nozzle 71 is more likely to wait at theimmediately-previous standby position during the discharge of thethinner That is, it becomes easy to set a processing nozzle such thatthe resist nozzle 71 is disposed at the immediately-previous standbyposition after a process is performed by the resist nozzle 71 in oneprocessing part 22 and before the discharge of the thinner in anotherprocessing part 22 is terminated. That is, even if the resist nozzle 71is shared by the processing parts 22, the operation thereof does notlimit the processing of the wafer W, and the waiting time until resistcoating is performed on the wafer W is suppressed, whereby higherthroughput can be obtained more reliably.

In addition, as described above, depending on the processing state of awafer W in one processing part 22, the processing schedule of a wafer Win another processing part 22 is determined. The determination of theprocessing schedule is performed such that the overlapping period of theprocessing schedules in respective processing parts 22 becomes longer asdescribed above with reference to FIG. 12. Accordingly, in processing aplurality of wafers W in a continuous manner, it is possible to increasethroughput more reliably.

Next, a processing recipe different from the above-described processingrecipe of the thinner and the resist will be described. The resistnozzle 71 is disposed such that the resist is discharged to a firstposition apart from the center of a rotating wafer W, and the individualnozzle 54 is disposed such that the thinner B1 is discharged to a secondposition closer to the peripheral edge of the wafer W than the firstposition. Then, the discharge of each of the resist R and the thinner B1is performed. As illustrated in FIG. 23, the resist nozzle 71 is movedin the lateral direction such that position at which the resist R isdischarged is shifted to a position above the center of the wafer W, andthus the impact at the time of landing liquid on the wafer W isalleviated and the scattering of the liquid from the liquid landingposition is suppressed. By supplying the resist R and the thinner B1 inthis manner, a liquid collection portion of the resist R is located atthe center on the wafer W, and the thinner B1 is supplied to the wafer Wso as to surround the liquid collection portion. Thereafter, therotation speed of the wafer W is increased. Accordingly, at theperipheral edge portion of the wafer W at which the supply of thethinner B1 has been terminated, the resist R is spread so as to havehigh coatability with respect to the peripheral edge portion, and theentire front surface of the wafer W is more reliably coated with theresist R.

In the processing in FIG. 23, the time zone in which the thinner B1 isdischarged and the time zone in which the resist R is discharged may notbe clearly separated from each other. That is, without being limited toterminating the discharge from one nozzle and then starting thedischarge from another nozzle, it is possible to perform a process suchthat the time zone in which the resist R is discharged and the time zonein which the thinner B1 is discharged overlap. In FIG. 23, there isshown a state in which the time zone in which the resist R is dischargedand the time zone in which the thinner B1 is discharged overlap eachother. In a case in which a processing recipe is set such that the timezone in which the thinner B1 is discharged and the time zone in whichthe resist R is discharged overlap each other, the shared arm 67, whichholds the resist nozzle 71, may be operated at a timing according to theprocessing recipe. When the processing recipe described with referenceto FIG. 23 is performed, this is preferable because the movementtrajectories D1 to D3 of the nozzles described above do not overlap evenon the center of the wafer W.

The processing liquid supplied from the peripheral nozzle 44 is notlimited to the thinner For example, a processing liquid for forming aprotective film may be discharged instead of the thinner, so that theperipheral edge portion of the wafer W after the formation of the resistfilm may be covered with the protective film. This protective film is aprotective film for preventing film peeling at the peripheral edgeportion of the wafer W. When such a protective film is formed, it may berequired to increase the uniformity of the film thickness in thecircumferential direction of the wafer W. Assuming that the peripheralnozzle 44 is moved by the rotation mechanism as described above, when aliquid landing position is shifted in the radial direction in order tochange the width of the region in which the protective film is formed,the liquid landing position may also be shifted in the circumferentialdirection of the wafer W. As a result, the uniformity of the filmthickness in the circumferential direction of the wafer W may bereduced. From the viewpoint of preventing this, it is preferable thatthe peripheral nozzle 44 be moved by the linear motion mechanism 41 asdescribed above.

When the resist discharge time is longer than the discharge time of thethinner from the nozzle that performs cleaning (pre-wet), a nozzle thatdischarges the thinner may be shared by respective processing parts 22,and a nozzle that discharges the resist may be provided for eachprocessing part 22. That is, a nozzle having a long processing liquiddischarge time is provided for each processing part 22, and a nozzlehaving a short processing liquid discharge time is shared by theprocessing parts 22. With such a configuration, the discharge of theprocessing liquid from the nozzle having a short discharge time and/orthe movement of the nozzle having a short discharge time between theprocessing parts 22 may be performed while the processing liquid isbeing discharged from the nozzle having a long discharge time.Accordingly, throughput can be increased.

A camera for capturing an image of the resist nozzle 71 held by theshared arm 67 from a different direction from the camera 84 provided onthe shared arm 67 may be provided to be fixed to the cup 31. In someembodiments, the camera 84 may not be provided on the shared arm 67, anda plurality of cameras that capture images of the resist nozzle 71 heldby the shared arm 67 from different directions may be fixedly providedon the cup 31. The images obtained from the cameras fixed on the cup 31may be used to detect various abnormalities, similarly to the imagesobtained from the camera 84.

Based on a time difference between the start timing of a series ofprocesses in one processing part 22 and the start timing of a series ofprocesses in another processing part 22 described with reference to FIG.12, it may be determined whether or not the nozzle 71, which has beenused in one processing part 22, is made to wait at the standby position62 in the standby part 61. That is, when the time difference is shorterthan a predetermined set time, the resist nozzle 71 is made to wait, forexample, above the standby position 62, rather than being transferred tothe standby position 62. Meanwhile, when the time difference is equal toor longer than the predetermined set time, the resist nozzle 71 istransferred to and made to wait at the standby position 62.

The arm 53 may be provided with a plurality of individual nozzles 54configured to discharging different types of thinner, and the thinnermay be discharged from any one selected individual nozzle 54. Inaddition, the number of the processing parts 22 is not limited to three,and may be four or more. In addition, the number of the processing parts22 may be two. However, by configuring the resist supply mechanism 6 tobe shared by a relatively large number of processing parts 22, it ispossible to reduce the number of modules and the number of processingliquid supply lines in providing a plurality of resist coating modules 2in the apparatus, and to reduce the manufacturing cost of the apparatus.In addition, it is possible to achieve a reduction in the number ofprocesses for manufacturing and maintenance. As described above, theresist coating module 2 is advantageous because it is configured tosuppress a decrease in throughput even if the number of the processingparts 22 is large. In addition, the coating apparatus of the presentdisclosure is not limited to a configuration for coating a resist toform a resist film. For example, the technology of the presentdisclosure may be applied to an apparatus for forming an anti-reflectionfilm by coating a processing liquid for anti-reflection film formationor an apparatus for forming an insulation film by coating a processingliquid for insulation film formation. That is, a configuration may beemployed in which processing liquids for forming these films aresupplied to the processing parts 22 from a shared nozzle.

According to the present disclosure in some embodiments, high throughputcan be obtained and space can be saved in a coating apparatus that formsa coating film by supplying a coating liquid to a substrate.

It should be noted that the embodiments disclosed herein are exemplaryin all respects and are not restrictive. The above-described embodimentsmay be omitted, replaced or modified in various forms without departingfrom the scope and spirit of the appended claims.

What is claimed is:
 1. A coating apparatus comprising: a plurality ofsubstrate holders each configured to hold a substrate; a first nozzleprovided for each of the plurality of substrate holders and configuredto discharge a first processing liquid to the substrate at a firstdischarge position on the substrate held by each of the plurality ofsubstrate holders; a second nozzle provided to be shared by theplurality of substrate holders and configured to move independently ofthe first nozzle and discharge a second processing liquid for forming acoating film to the substrate at a second discharge position on thesubstrate held by each of the plurality of substrate holders, after thedischarge of the first processing liquid; a third nozzle provided foreach of the plurality of substrate holders and configured to moveindependently of the first nozzle and the second nozzle and discharge athird processing liquid to the substrate at a third discharge positionon the substrate held by each of the plurality of substrate holderswhile the first processing liquid and the second processing liquid arenot supplied to the substrate; a first standby part, a second standbypart, and a third standby part configured to respectively allow thefirst nozzle, the second nozzle, and the third nozzle to wait outside aregion in which the substrate is held by each of the plurality ofsubstrate holders in a plan view; a turning mechanism configured to turnthe first nozzle in a plan view between the first standby part and thefirst discharge position; and a linear motion mechanism configured tolinearly move the third nozzle in a plan view between the third standbypart and the third discharge position.
 2. The coating apparatus of claim1, wherein the first processing liquid is a thinner, and the secondprocessing liquid is a processing liquid for forming a film on thesubstrate.
 3. The coating apparatus of claim 1, wherein a first movementtrajectory of the first nozzle in a plan view between the first standbypart and the first discharge position, a second movement trajectory in aplan view between the second standby part and the second dischargeposition, and a third movement trajectory of the third nozzle in a planview between the third standby part and the third discharge position donot overlap each other except for a common discharge position in a casewhere the first discharge position and the second discharge position arelocated at the common discharge position where the first dischargeposition and the second discharge position overlap each other in a planview.
 4. The coating apparatus of claim 1, further comprising: at leastone illumination configured to move with the second nozzle and toirradiate the second nozzle with light; and an image capturing partconfigured to move with the second nozzle and to capture an image of thesecond nozzle irradiated with the light by the at least oneillumination.
 5. The coating apparatus of claim 4, wherein the at leastone illumination includes a plurality of illuminations provided toirradiate the second nozzle with the light from different directions. 6.The coating apparatus of claim 1, wherein a period during which thefirst processing liquid is discharged from the first nozzle to thesubstrate is longer than a period during which the second processingliquid is discharged from the second nozzle to the substrate.
 7. Thecoating apparatus of claim 1, further comprising a controller, wherein,if a substrate held by a first substrate holder among the plurality ofsubstrate holders is a first substrate and a substrate held by a secondsubstrate holder among the plurality of substrate holders is a secondsubstrate, and a continuous process is performed from a timing at whichthe first nozzle starts to move from the first standby part to a timingat which the second nozzle terminates the discharge of the secondprocessing liquid, the controller is configured to output a controlsignal such that a period during which the continuous process isperformed on the first substrate and a period during which thecontinuous process is performed on the second substrate overlap eachother.
 8. The coating apparatus of claim 7, wherein the controller isconfigured to determine a start timing of the continuous process on thesecond substrate depending on a timing at which the continuous processis terminated while the continuous process is performed on the firstsubstrate.
 9. The coating apparatus of claim 8, wherein the controlleris configured to adjust, within a preset range, an interval fromtermination of the discharge of the first processing liquid to thesecond substrate until discharge of the second processing liquid to thesecond substrate.
 10. The coating apparatus of claim 1, wherein thesecond nozzle waits above the substrate while the first processingliquid is being discharged from the first nozzle to the substrate. 11.The coating apparatus of claim 7, further comprising: a determinationmechanism, wherein, based on whether or not the second substrate is tobe transferred to the second substrate holder while the continuousprocess is being performed on the first substrate, the determinationmechanism is configured to determine whether to move the second nozzleto the second standby part after the discharge of the second processingliquid to the first substrate or whether to move the second nozzletoward the second discharge position corresponding to the secondsubstrate without moving the second nozzle to the second standby part.12. The coating apparatus of claim 7, further comprising: adetermination mechanism, wherein, depending on an interval between astart timing of the continuous process on the first substrate heldpreviously by the first substrate holder among the plurality ofsubstrate holders and a start timing of the continuous process on thesecond substrate held currently by the second substrate holder among theplurality of substrate holders, the determination mechanism isconfigured to determine whether to move the second nozzle to the secondstandby part after the discharge of the second processing liquid to thefirst substrate or whether to move the second nozzle toward the seconddischarge position corresponding to the second substrate without movingthe second nozzle to the second standby part.
 13. The coating apparatusof claim 1, further comprising: an image capturing part and aillumination part provided to be movable by sharing a driving part ofthe second nozzle, the image capturing part configured to capture animage of the second nozzle, and the illumination part configured toilluminate the second nozzle, wherein the illumination part isconfigured to illuminate the second nozzle from each of two regionsspaced apart from each other by a straight line connecting the secondnozzle and the imaging part in a plan view.
 14. The coating apparatus ofclaim 13, wherein the illumination part includes an upper illuminationmember configured to illuminate the second nozzle from above the secondnozzle.
 15. A coating method comprising: holding substrates by aplurality of substrate holders, respectively; disposing each of firstnozzles provided for each of the plurality of substrate holders at afirst discharge position on the substrate held by each of the pluralityof substrate holders, and discharging a first processing liquid to eachof the substrates; moving a second nozzle provided to be shared by theplurality of substrate holders, independently of the first nozzle, anddisposing the second nozzle at a second discharge position on thesubstrate held by each of the plurality of substrate holders;discharging a second processing liquid for forming a coating film fromthe second nozzle at the second discharge position to the substrateafter the first processing liquid is discharged from the first nozzle tothe substrate; and moving each of the first nozzles to turn between afirst standby part and the first discharge position in a plan view, thefirst standby part being configured to allow each of the first nozzlesto wait outside a region in which each of the substrates is held by eachof the plurality of substrate holders in a plan view.
 16. The coatingmethod of claim 15, wherein, if a substrate held by a first substrateholder among the plurality of substrate holders is a first substrate anda substrate held by a second substrate holder among the plurality ofsubstrate holders is a second substrate, and a continuous process isperformed from a timing at which the first nozzle starts to move fromthe first standby part to a timing at which the second nozzle terminatesthe discharge of the second processing liquid, a period during which thecontinuous process is performed on the first substrate and a periodduring which the continuous process is performed on the second substrateoverlap each other.
 17. The coating method of claim 16, furthercomprising: determining a start timing of the continuous process on thesecond substrate depending on a timing at which the continuous processis terminated while the continuous process is being performed on thefirst substrate.